德路推出新型雙固化環氧膠粘劑，在光照預處理后，60℃即能達到最終強度。新型環氧膠粘劑主要應用于電子行業。

　　這個系列的產品在較低溫度時即可完成交聯固化，比以前的產品快了三倍。新型粘合劑僅需半秒的光照預處理。在生產線上，這樣快速的預處理是特別有利的，如此以來，在組件分配固定后，將被直接轉移到工藝鏈的下一步，避免了生產線上該類組件的滑動，這樣就保證了生產的重復性和快速性。

　　快,更快，再快-非常低的溫度下固化

　　這款新型膠粘劑的固化溫度很低，從而降低了材料之間的熱應力。除此之外，他還可以毫無困難的應用在熱敏基質的材料上，因為更高的溫度只會損壞熱敏元件。

　　對于這款純低溫固化膠粘劑而言，它僅需30分鐘以及60度的低溫就能實現最終強度。而目前為止，在相同的溫度下，合格的同類產品是需要90分鐘才能達到這個效果。這就使得德路的這款新產品成為其中最快的一種。而且他們仍然能夠保持其良好的性能。

　　原文如下：

　　DELO has developed new dual-curing adhesives that reach full strength at only 60 °C after prefixation by light. The new range is completed by adhesives curing in a single step at low temperatures, three times faster than previous products. These epoxy resin-based adhesives are mainly used in electronics.

　　The new dual-curing adhesives from DELO can be prefixed after only half a second of exposure to light. Prefixing is particularly advantageous in the case of production lines, since, after dispensing and fixation, the component will be directly transferred to the next step of the process chain. This guarantees reproducibility and fast production, avoiding incidents like the slipping of individual components. Products of the DUALBOND family also feature excellent adhesion to LCP and allow adjustment of the adhesive properties ranging from flexible to hard (elongation at tear up to 70%).

　　Fast, faster, the fastest – very low temperature curing

　　The low curing temperature of these new adhesives reduces the thermal stress between the materials, thus limiting the stress on the component. In addition to that, they allow processing of temperature-sensitive substrates without difficulty: higher temperatures would only damage the sensitive components.

　　For purely low-temperature-curing adhesives, it only takes 30 minutes and a temperature of 60 °C to achieve their final strength. This makes them the fastest of their kind. So far, standard products have generally taken 90 minutes at the same temperature to achieve full strength. And still they are able to maintain their favorable properties such as their good adhesion to plastics like LCP, PA, and PPS or their flexibility on the component.