Master Bond新推多功能環(huán)氧樹脂Supreme 3HTND-2CCM。它非常適合用于芯片涂層，頂部封裝和芯片連接以及粘接、密封和封裝。由于是單組份體系，所以它使用前不需要混合，室溫存儲性能很好。該環(huán)氧樹脂還通過NASA低放氣試驗(yàn)，可用于真空、航空航天和無塵車間。

　　原文如下：

　　Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which allow it to be used in vacuum, aerospace and clean room applications.

　　Supreme 3HTND-2CCM has a paste consistency that flows slightly while curing. It cures readily at elevated temperatures. The minimum curing schedule is 20-30 minutes at 250°F or 5-10 minutes at 300°F. This is a filled system with low shrinkage upon curing and sound dimensional stability. It bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. This high strength system delivers tensile lap shear, tensile and compressive strength of 1,800-2,000 psi, 6,000-7,500 psi and 15,000-17,000 psi, respectively.

　　This electrically insulative compound features a thermal conductivity of 10-11 BTU•in/ft2•hr•°F [1.44-1.59 W/(m·K)]. Supreme 3HTND-2CCM resists many chemicals, such as water, acids, bases, fuels and some solvents. Its inherent toughness allows it to withstand aggressive thermal cycling.

　　Supreme 3HTND-2CCM is serviceable over the wide temperature range of -100°F to +400°F. This epoxy has a black color and is available for use in syringe, pint, quart and gallon containers.

　　關(guān)于Master Bond：

　　Master Bond公司成立于1976年，位于美國新澤西州，是一家專業(yè)膠粘劑和密封及涂料化工產(chǎn)品供應(yīng)商，擁有3000多種高性能膠粘劑、密封劑、膠衣等產(chǎn)品。主營環(huán)氧樹脂，有機(jī)硅，聚氨酯，聚硫化物，紫外線固化和其他特種膠粘劑體系。,