<strike id="wa20c"></strike>

<fieldset id="wa20c"></fieldset>

<abbr id="wa20c"></abbr>

<tfoot id="wa20c"></tfoot>

<fieldset id="wa20c"></fieldset>

	PAT. NO.	Title
1	9,221,969	Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures
2	9,215,803	Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
3	9,212,295	Production method for obtaining fiber-reinforced composite material, and epoxy resin composition used therein
4	9,212,253	Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
5	9,212,251	Amino group terminated impact strength modifier and use thereof in epoxy resin compositions
6	9,206,308	Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
7	9,200,133	Curable epoxy resin composition
8	9,187,592	Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam
9	9,181,463	Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds
10	9,175,145	Polymeric epoxy resin composition
11	9,169,418	Thermosetting epoxy resin composition and uses thereof
12	9,169,347	Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
13	9,169,346	Epoxy resin varnishes, laminates and printed circuit boards
14	9,163,170	Epoxy resin composition including silica and core-shell polymer particles
15	9,163,112	Reactive polymer catalysts for 2-component epoxy resin systems
16	9,153,513	Epoxy resin composition and semiconductor apparatus prepared using the same
17	9,150,709	Epoxy resin compositions comprising a 2-oxo-[1,3] dioxolane derivative
18	9,145,488	Aluminum phosphorus acid salts as epoxy resin cure inhibitors
19	9,133,301	Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions
20	9,125,309	Epoxy resin, curable resin composition and cured product thereof, and printed wiring board
21	9,123,689	Epoxy resin composition, method for producing same, and semiconductor device using same
22	9,102,786	Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
23	9,096,759	Printing form and process for preparing the printing form with curable composition having solvent-free epoxy resin
24	9,096,708	Partially esterified epoxy resin and epoxy resin composition applied with the same, and method for preparing the composition
25	9,080,007	Anhydride accelerators for epoxy resin systems
26	9,075,303	Optical waveguide forming epoxy resin composition, curable film formed from the epoxy resin composition for formation of optical waveguide, and light transmission flexible printed board
27	9,074,041	Curable epoxy resin compositions and composites made therefrom
28	9,068,074	Composition for formation of cured epoxy resin, and cured products thereof
29	9,067,906	Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
30	9,056,943	Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
31	9,048,402	Epoxy resin composition and light emitting apparatus
32	9,048,187	Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
33	9,045,585	Toughened epoxy resin formulations
34	9,040,606	Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent
35	9,024,347	Epoxy resin composition and light emitting apparatus
36	9,023,956	Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
37	9,023,683	Organic semiconductor transistor with epoxy-based organic resin planarization layer
38	9,012,009	Epoxy resin adhesive composition and perforated floor panel for clean room comprising the same
39	9,000,071	Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
40	8,987,358	Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductor
41	8,987,355	Epoxy resin composition for sealing, and electronic component device
42	8,981,160	Modified liquid epoxy resin as well as epoxy resin composition using the same and cured product thereof
43	8,980,376	Storage stable epoxy resin compositions for electrical laminates
44	8,969,490	Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device
45	8,963,344	Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device
46	8,963,180	Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
47	8,947,981	Attenuating mass for an ultrasonic sensor, use of epoxy resin
48	8,937,145	Epoxy resin compositions
49	8,928,158	Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
50	8,927,677	Toughening agent for epoxy resin compositions